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System(s)-on-a-Chip: Changes in SoC Design Methodology II

The System-on-a-Chip (SoC) method of creating silicon solutions is delivering on the original high expectations for the future of the semiconductor industry and ASIC markets.  Designs of very high complexity are regularly accomplished using this approach today, far beyond what was possible only five or six years ago using more traditional ASIC methodologies. A new published report from Semico Research, System(s)-on-a-Chip: Changes in SoC Design Methodology forecasts that the SoC Market Forecast will approach $200 Billion by 2019.
 

Table of Contents: 
TOC_SC103-15.pdf

Licensing, Royalty and Service Revenues for 3rd Party SIP: A Market Analysis and Forecast for 2015

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market. A new report from Semico Research, "Licensing, Royalty and Service Revenues for 3rd Party SIP: Market Analysis and Forecast for 2015," forecasts the worldwide IP Market to approach 8 billion by 2019.

Table of Contents: 
TOC_SC102-15.pdf

SoC Silicon and Software Design Cost Analysis: How Rising Costs Impact SoC Design Starts

One of the most pressing problems silicon and software designers face today is the rising design costs they face at each new process node going forward. These costs have an impact on the number of 1st time System-on-a-Chip (SoC) designs and the resultant derivative designs.

Table of Contents: 
TOC_SC101-15.pdf

ASIC Design Starts for 2014 by Key End Market Applications

Improving market financials and continuing end market demand are combining to push ASIC Design activity to new levels.  The Basic SoC market is being driven by the emergence in the Internet of Things (IoT) and the need for silicon solutions for this segment. Mixed Signal ASIC designs have been growing for the last few years as more and more systems seek to interface to analog type 'real world' functions.

Table of Contents: 
TOC_SC101-14.pdf

ASIC Design Starts: Growth Continues as Markets Strengthen

Today, silicon designs show rapidly increasing levels of complexity in response to end user demands for more connectivity and the ability to use that connectivity in applications like downloading video, video conferencing, device hot spots, increasing camera resolution for richer photos and better screen resolution to enhance user experience.   An additional trend is to include sensors of every type for a better interface and interaction with the outside world.

Table of Contents: 
TOC_SC102-14.pdf

IMPACT 2013 Videos

Did you miss the IMPACT Conference?  Semico recorded all the speeches, and they are available for purchase.  Please see the "ToC" below to read the agenda. 

These videos are all available on this page once you login.  If you registered and don't have an account, please send us an email. 

IPextreme also recorded videos for their technical track.  Those videos are available on their youtube channel here. 

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IMPACT Conference Agenda _ Semico Research.pdf

The IP Subsystem Market: Evolution Continues and Momentum Builds

In the last 10 years, the semiconductor industry has undergone a considerable amount of change driven by the need to increase integration to meet rising customer expectations of performance and functionality. In the System-on-Chip (SoC) market, this has been accomplished by the increasing use of discrete 3rd Party Semiconductor Intellectual Property (SIP) blocks of all types to aid SoC designers in crafting ever more complex silicon solutions.

Table of Contents: 
TOC_SC104-13.pdf

Licensing, Royalty and Service Revenues For 3rd Party SIP: A Market Analysis and Forecast for 2013

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.

Table of Contents: 
TOC_SC103-13.pdf

SoC Silicon and Software Design Cost Analysis: Costs for Higher Complexity Continue to Rise

Today, everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth path. As part of this problem, we now recognize that software design costs have eclipsed silicon design efforts and have become the largest portion of the SoC creation effort. In addition, IP integration costs are now rising as more discrete IP blocks are infused into SoC designs today.

Table of Contents: 
TOC_SC102-13.pdf

System(s)-on-a-Chip: Changes in SoC Design Methodology

Advances in the 3rd Party Semiconductor Intellectual Property (SIP) market as well as in the Electronic Design Automation (EDA) market have allowed silicon designers to increase the complexity in their silicon solutions to the point where the industry can actually think about these solutions in the plural sense, as System(s)-on-a-Chip (SoC).

Table of Contents: 
TOC_SC101-13.pdf

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