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Consulting

Semico consultants have a deep industry insight throughout the electronics ecosystem. They create innovative solutions tailored to the clients’ specific needs, creating insightful, measured analysis and presentations that lead to actionable strategies. Their subject matter experts have assisted management in defining markets, developing business and strategic marketing plans, and conducting competitive analysis at IDMs, fabless semiconductor suppliers, foundries, equipment companies, material suppliers, OEMs and financial institutions. Semico can develop a picture of a company's competitive position in the market and provide them with the data and analysis required to improve the expressed company objective and ultimately their position in the marketplace.

Semico understands the challenges that companies face, such as rising costs, the development of technology roadmaps, reducing time to market, and overall market perceptions.  Semico's solutions are both quantifiable and quantitative and easily integrated into new company strategies addressing today's challenges caused by converging markets, consolidation, new platforms, and design issues.

Semico consultants work seamlessly and collaboratively with their clients to assist them in the development of their market strategies and their ultimate implementation to increase their profitability and/or transform their business.

The following is a representative list of Semico's consulting projects, clients, and topic expertise.  For a comprehensive list contact Jim Feldhan at (602) 997-1637 or at jimf@semico.com.

Custom & Consulting Projects Consulting & Custom Projects
Clients (partial list)

Topic Expertise

Jump to a section:  Manufacturing, End Markets, ASIC/SoC Design, Semiconductors, Memories

  • IC & Wafer Revenue, Units, ASP and Si demand
  • White Papers
  • Forecasts
  • New Product Development
  • Business Planning
  • Technology Assessments
  • Market Analysis
  • Manufacturing Process Analysis
  • Intellectual Property
  • Benchmarking
  • Technology Roadmaps
  • Strategic Planning
  • Pricing Studies
  • Cost Analysis
  • New Product Assessment
  • Financial Analysis
  • M & A Due Diligence
  • Market Forensics
  • End Market Analysis
  • Market Share Analysis
  • Market Sizing/TAM, SAM Analysis
  • Pricing Trends
  • Product Life Cycles
  • Competitive Analysis
  • Bill of Materials Analysis

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  • Altera
  • ARC
  • ASM
  • Avnet, Inc.
  • Center for Economic Growth, New York State
  • Corning
  • Cypress Semiconductor
  • Department of Defense, US Government
  • Freescale
  • GlobalFoundries
  • Grant Thornton
  • IBM
  • IDT
  • Intel
  • McKinsey
  • Mentor Graphics
  • MIT
  • DOD
  • Open Silicon
  • Price Waterhouse
  • Rambus
  • Qualcomm
  • SEMI
  • Sony
  • Synopsys
  • TSMC
  • Xilinx

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Semiconductor Manufacturing

  • IC & Wafer Demand by node
  • Wafer size Demand
  • Capital Expenditures
  • Foundry Capacity
  • Foundry Supply/Demand
  • Capacity Utilization
  • Fab capacity
  • New materials
  • Lithography
  • Used Semiconductor Equipment
  • Manufacturing technology roadmap

End Market Analysis

  • Personal Computing (PC)
  • Desktop PC
  • Notebook PC
  • Tablet
  • Servers
  • Workstations
  • Video game consoles
  • TV Set Top Box
  • Wearables
  • Hard Disk Drive (HDD)
  • Solid State Drive (SSD)
  • Internet of Things (IoT)
  • IoT security
  • Smart Lighting
  • Smart Home
  • Home automation
  • Energy Harvesting
  • Automotive
  • Wireless
  • Smartphones High end
  • Smartphones Low end
  • Basic Cell Phones

ASIC/SoC Market Analysis

  • TAM, SAM analysis
  • ASIC & SoC design starts by end market analysis
  • IP Subsystems by functionality, by SoC type, by region, by process geometry
  • 3rd Party IP Market – CPU, GPU, DSP, Memory, Analog, Logic, Security, Audio, Interconnect, Chip Enhancement, Interface
  • SoC Silicon and Software
  • Design Costs by SoC type and process geometry
  • ASIC & SoC Design Starts
  • Semiconductor Market Analysis by device type, by process geometry, by region
  • Market share analysis

Semiconductor Products

  • Programmable Logic market
  • FPGA market
  • Standard Cell market
  • Gate Array market
  • Mixed Signal ASIC market
  • SoC market
  • MEMS
  • Optical MEMS (MEOMS)
  • Sensors
  • Sensor Fusion
  • Microprocessors (MPUs)
  • Microcontrollers (MCUs)
  • Digital Signal Processors (DSPs)
  • CPU cores
  • System on Chip (SoC)
  • Embedded Processors
  • Embedded Control
  • Wi-Fi
  • ZigBee
  • ZWave
  • Bluetooth
  • Thread

Memory Market Analysis

  • Revenues/Units/ASPs by density
  • Applies to all memory categories
  • DRAM
  • NAND
  • NOR
  • SRAM
  • Pseudo-SRAM
  • PSRAM
  • Fast Asynchronous SRAM
  • Slow Asynchronous SRAM
  • Synchronous SRAM
  • Sync Burst SRAM
  • ZBT/NoBL/NtRAM
  • DDR SRAM
  • QDR SRAM
  • SigmaRAM
  • Dual Port SRAM
  • FeRAM
  • PCM
  • Phase-Change Memory

 

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