Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
The semiconductor industry today is faced with several substantial issues—not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2024. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
In June 2019, Semico Research initiated a study to quantify the total available market (TAM) for IP cores and estimate the served available market (SAM) for RISC-V IP cores. We surveyed and interviewed a cross section of the semiconductor industry in order to gather information related to the type of devices that are being designed with RISC-V and their target markets.
Energy harvesting, also known as power scavenging, is used to describe the collection of energy derived from a variety of external sources such as solar power, thermal energy, wind energy, kinetic energy or electromagnetic sources. Energy harvesters accumulate the wasted energy in a system, such as heat given off by motors or semiconductors, or the vibrations of motors or other moving objects, for use in another system.
The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
Semico tracks over 1,000 semiconductor fabs in its Fab Database. The database includes detailed information about the fabs, including the operating status of the fab, its location, process and products, wafer size and capacity, and more. The other document included with the database is a Word file containing a summary of updates made to fabs by company type: Memory, Foundries, and Other.
Many of the traditional end-use applications are experiencing slower design start growth rates due to maturing markets and high design costs. The unit volumes associated with all applications remain healthy, exhibiting an 8.5% CAGR through 2023. However, removing the unit shipments attached to the new, emerging applications drops the CAGR to only 4.3% through 2023.
Semico Research's new report, Design Starts for 2019 by Key End Market Applications, SC106-19, offers a comprehensive analysis of the ASIC design start landscape today and into the future. It provides excellent data for product planning, marketing and sales activities at fabless semiconductor companies, 3rd Party IP vendors and major OEMs and IDMs. The report includes:
