Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
The 3rd Party Semiconductor Intellectual Property (IP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party IP market.
The 3rd Party Semiconductor Intellectual Property (SIP) and the System-on-a-Chip (SoC) markets are undergoing good revenue growth as the world continues to move past the COVID-19 pandemic. Headwinds with weakness in global economies and inflation pose some overall concern, but Semico is assuming any economic downturn will not be long or severe. Augmenting these trends is the emergence of Artificial Intelligence (AI) functionality that is being incorporated in many SoCs and applications.
The 3rd Party Semiconductor Intellectual Property (SIP) and the System-on-a-Chip (SoC) markets are undergoing good revenue growth as the world continues to move past the COVID-19 pandemic. Headwinds with weakness in global economies and inflation pose some overall concern, but Semico is assuming any economic downturn will not be long or severe. Augmenting these trends is the emergence of Artificial Intelligence (AI) functionality that is being incorporated in many SoCs and applications.
The semiconductor industry is in the midst of a great deal of upheaval in 1Q 2023, brought on by COVID-19 and geopolitical tensions. With the semiconductor shortages brought on by disruptions caused by the COVID-19 pandemic, announcements in new fab projects and expansions reached a fever pitch in 2022. Moving toward self-sufficiency is a new goal for countries in the wake of the increased level of geopolitical tension around the world.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2027. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
SoC design methodology has been affected by EDA vendors who have been active in proposing several changes and improvements that encompass analyzing the SoC design process as a complete—SIP creation, SIP integration, SoC design, applications software development, and EDA tools required to manage the total design process.
Today's designs are focused on complexity driven by AI functionality and integration of wireless interfaces. They are many times more complex than those from several years ago. This complexity is driving design costs up to higher levels than the industry has previously seen.
The semiconductor industry is in the midst of a great deal of upheaval in 1Q 2023, brought on by COVID-19 and geopolitical tensions. With the semiconductor shortages brought on by disruptions caused by the COVID-19 pandemic, announcements in new fab projects and expansions reached a fever pitch in 2022. This has been particularly true of the United States, as companies seek to diversify production away from China. Moving toward self-sufficiency is a new goal in the wake of the increased level of geopolitical tension around the world. A number of countries are pledging money ...
published by Semico_Admin on Wed, 2023-02-22 20:38
Principal Analyst Rich Wawrzyniak participated in a webinar hosted by Achronix, titled The Rise of the Chiplet. The webinar took place on February 9, 2023 and was moderated by SemiEngineering’s Brian Bailey. The panel members were Achronix’s Nick Ilyadis, Semico’s Rich Wawrzyniak, and ODSA’s Bapi Vinnakota. They discussed the current landscape for chiplet technology, predictions for the coming years, what’s needed for chiplet adoption, and the status and evolution of die-to-die interface standards, as well as answered live questions.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2026. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
