Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
Energy harvesting, also known as power scavenging, is used to describe the collection of energy derived from a variety of external sources such as solar power, thermal energy, wind energy, kinetic energy or electromagnetic sources. Energy harvesters accumulate the wasted energy in a system, such as heat given off by motors or semiconductors, or the vibrations of motors or other moving objects, for use in another system.
The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
Semico tracks over 1,000 semiconductor fabs in its Fab Database. The database includes detailed information about the fabs, including the operating status of the fab, its location, process and products, wafer size and capacity, and more. The other document included with the database is a Word file containing a summary of updates made to fabs by company type: Memory, Foundries, and Other.
Many of the traditional end-use applications are experiencing slower design start growth rates due to maturing markets and high design costs. The unit volumes associated with all applications remain healthy, exhibiting an 8.5% CAGR through 2023. However, removing the unit shipments attached to the new, emerging applications drops the CAGR to only 4.3% through 2023.
Semico Research's new report, Design Starts for 2019 by Key End Market Applications, SC106-19, offers a comprehensive analysis of the ASIC design start landscape today and into the future. It provides excellent data for product planning, marketing and sales activities at fabless semiconductor companies, 3rd Party IP vendors and major OEMs and IDMs. The report includes:
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.
Artificial Intelligence (AI) is anticipated to be the next big market driver that will create new or additional semiconductor demand for a wide spectrum of semiconductor devices. We believe that AI will be integrated in devices from the cloud to factories, homes, offices and vehicles. The application must accommodate mobile and IoT products. The second publication in Semico’s series of AI-related reports and presentations, this report addresses two large markets for AI: the smart home and the automotive markets. Fifteen smart home end-point devices, as well as 15 automotive systems are
published by Rich Wawrzyniak on Fri, 2019-03-15 21:56
This week, Facebook announced it had acquired Sonics, Inc., a 3rd Party Semiconductor Intellectual Property (SIP) vendor. Sonics is one of the mainstays of the SIP market for Interconnect SIP, which is used to tie together the multiple tens or hundreds of SIP blocks found on contemporary System-on-a-Chip (SoC) silicon solutions today. Sonics was founded in 1996 and was at the heart of the emerging SoC market in its early years along with ARC, ARM, MIPS, Analog Bits, Virage Logic and many others.
It is no surprise that a company like Facebook, who is designing their own AI-focused SoCs, would purchase a company like Sonics. While no details of this acquisition have been released, some reasoned insights are possible.
Implications for the Market
This acquisition removes a major player for Interconnect SIP from the market. Sonics’ customers must now determine how long Sonics will support them and at what level. It is reasonable to expect these customers will look to other suppliers for their interconnect requirements.
