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Artificial Intelligence: Powering the Next Generation of Processors

Artificial Intelligence (AI) functionality has emerged into the semiconductor market with many companies participating at all levels of the semiconductor, software, services and IP industries offering a variety of products. The emergence of the AI market represents the 'next big thing' for both the semiconductor industry as well as the overall economy. Deployment has already started in factory floor environments delivering better control and maintenance over a multitude of industrial processes and products.

Table of Contents: 
TOC_MP104-18.pdf

Licensing, Royalty and Service Revenues For 3rd Party SIP: A Market Analysis and Forecast for 2018

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years.  If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.  This new Semico Research Report, Licensing, Royalty and Service Revenues for 3rd Party SIP: A Market Analysis and Forecast for 2018, (SC105-18) forecasts revenue for the SoC IP market to approach $10 Billion by 2022

Table of Contents: 
TOC_SC105-18.pdf

Semico Technology Brief -- System Design: More Options, More Design Starts?

In an ongoing effort to address major concerns and trends in the IP and design market spaces, there have been many alternative technologies offered as possible solutions.  Dielets or Chiplets is one such technology and it has recently gained momentum in that dialogue, highlighted by multiple discussions and conferences toward their use in multi-die subsystems and systems.
 
System Design: More Options, More Design Starts?,  a new Technology Brief from Semico, provides key insight into the dielet/chiplet technology and its possible adoption.
 

Table of Contents: 
TOC_SC112-17.pdf

ASIC Design Starts 2017: Consumer and Industrial Lead the Way

Many of the traditional end-use applications are experiencing slower semiconductor unit growth rates due to market saturation and reduced demand.  In addition, growth rates are more moderate when the sheer volumes of a market reach levels that make it difficult to continue experiencing double-digit growth rates.  While there are new applications such as those associated with the IoT (Internet of Things) and the Industrial Internet of Things (IIoT) which are expected to follow a higher growth curve over the next few years, in general, growth rates for traditional markets such as PCs and cell

Table of Contents: 
TOC_SC107-17.pdf

ASIC Design Starts for 2017 by Key End Market Applications

There is a great deal of design activity around emerging AI applications both at the Cloud level and for adding this type of functionality to edge devices in the form of Voice Activated Devices like the Amazon Echo and the Google Home Assistant among others.  Initially, limited AI functionality is being added to SoCs in the form of Convolutional Neural Networks (CNNs).

Table of Contents: 
TOC_SC106-17.pdf

System(s)-on-a-Chip: SoC Market Analysis and Forecast

There have been improvements in many areas of the SoC market from better, more useful Semiconductor Intellectual Property (SIP) to better EDA tools.  These improvements become masked by the fact that just as SoC designers master the technicalities and quirks of the current generation of process technologies, a new generation is introduced to the industry and the process resumes again.

Table of Contents: 
TOC_SC104-17.pdf

Licensing, Royalty and Service Revenues for 3rd Party SIP: A Market Analysis and Forecast for 2016

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years.  If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.

 

Table of Contents: 
TOC_SC105-16.pdf

The IP Subsystem Market: An Evolving Landscape

The next evolutionary step for the SoC Market is ... IP Subsystems.  This concept involves a "divide and conquer" design strategy that enables designers to increase integration and meet rising customer expectations of performance and functionality.  Semico Research has a new report, "The IP Subsystem Market:  An Evolving Landscape", which examines this market in detail.  Different SoC types are aimed at different applications, and the report details the average number of discrete IP blocks per Basic, Value Multicore, and Advanced Performance Multicore SoC.
Table of Contents: 
TOC_SC101-16.pdf

ASIC Design Starts: Automotive on a Fast Track

Increasing numbers of IoT solutions, adds to the growth in new design starts.  Certain applications, such as those associated with automotive, are expected to follow a higher growth curve over the next few years.  In addition to all the infotainment accessories and electric vehicle demands that have already been added to vehicles, the vision of autonomous driving brings a need for safety, connectivity and more accurate sensing capabilities.

Table of Contents: 
TOC_SC107-16.pdf

ASIC Design Starts for 2016 by Key End Market Applications

The end-use markets in this study offer high growth opportunities for IC manufacturers.  The market segments include computer, consumer, communication, industrial and transportation.  The end-use applications are a mix of mature and emerging devices.  Some of these products are convergent products that combine features from multiple market segments. 

Table of Contents: 
TOC_SC106-16.pdf

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