Panel sessions and presentations focus on latest innovations in technology including how board, chip and packaging companies can better function in an integrated, system-level ecosystem
Engineers and product designers face more challenges than ever before in bringing successful products to market. The advent of the IoT requires more features and mobility in new products. At the IMPACT Conference Boards, Chips and Packaging: Designing to Maximize Results, industry executives will highlight ways to solve these challenges.
The Internet of Things promises an unprecedented opportunity for the electronics industry. From front-end devices like roadway sensors to back-end network equipment supporting the rush of new data inputs, electronics are the integral foundation of this new era. More than ever, pressure is on the electronics industry to deliver the right solution at the right time and at the right price. A panel will discuss this important issue during the Semico IMPACT Conference: Designing to Maximize Results, October 13, Computer History Museum, 1401 N Shoreline Blvd., Mountain View, California 94043.
Semico expects to see a stronger market in the second half of 2015, based on strong increases in our IPI index in the second half of 2014. The IPI accurately predicts semiconductor revenue inflection points four quarters in advance. Recent economic events and fears of weakness in some end markets have resulted in substantial downgrades in forecasts from other prognosticators. In the past we too have fallen into this trap only to look back to say that the IPI was more correct. Forecasting the semiconductor market is not for the "faint of heart".
One of the most overlooked aspects of hardware design is the key role that materials selection plays in the overall product development process. For example, laminates are the foundation upon which all other components, both hardware and software, depend in order to ensure that the products into which they are incorporated are functionally operational.
The thirst for higher bandwidth--driven by mobile, Big Data, and higher performance computing applications--presents new challenges for the designers of very high speed PCBs and IC packages. Faster PCIe, SATA, and SAT interfaces and new 100G/400G systems featuring multi-lane 25-32Gbps SerDes (moving to 56Gbps), and higher density, lower power, smaller footprint HPC/HBM/3D NAND memory interfaces are sparking a move to signaling technologies (PAM4/8), improved board/package materials, and a better signal/power integrity design discipline.
Semico Research is proud to announce the speaker lineup for the 2015 Impact Conference, to be held October 13 at the Computer History Museum (1401 N Shoreline Blvd., Mountain View, California 94043). Confirmed speakers include the following:
Jim Feldhan, Semico Research Corp.
Tarun Amla, Isola
Daniel DeAraujo, Mentor Graphics
Brian Fuller, ARM
Lee Ritchey, Speeding Edge
Scott McMorrow, Samtec
Geoffrey Hazelett, Polar Instruments
Daniel DeAraujo, Mentor Graphics
Nathaniel Unger, Altera
Robert L. Sankman, Intel
