The MEMS, sensor and semiconductor industries have long been connected by a shared infrastructure and supply chain, but there are significant differences in the manufacturing of MEMS and sensors, including the use of unconventional materials, wafer bonding, packaging, lack of standard processes, to name a few. As the MEMS and sensor industries scale in volume and usage in conjunction with semiconductor devices, it's important that both industries take a deeper look at our common challenges to identify the issues that would benefit from a collaborative approach.