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Semico Research Announces Impact 2015 Panel - Boards, Chips & Packaging: Meeting Market Requirements

The Internet of Things promises an unprecedented opportunity for the electronics industry.  From front-end devices like roadway sensors to back-end network equipment supporting the rush of new data inputs, electronics are the integral foundation of this new era.  More than ever, pressure is on the electronics industry to deliver the right solution at the right time and at the right price. 
Product design is the foundation for each successive stage of the product development process and every player in the electronics ecosystem feels the pressure from the interdependence each time a product hand off occurs.  Delivering market tested electronics with precise designs demands coordination at all levels of product development.  All players are recognizing the need to collaborate throughout the design process including chip design, package design, material selection and board design to solve problems they all face together.
Designers across the electronics ecosystem must come to the table to address issues such as:

  • Parasitic capacitance and inductance issues that impact signal integrity;
  • Board material characteristics to deal with varying frequencies, especially high frequency;
  • New package form factors such as thinner packages and 2.5D and 3D packages;
  • Packages with tight interconnect spacing creating board design issues;
  • Board layout techniques to avoid cross talk, EMI, and short circuits;
  • Shorter design cycles with added cost pressure; and
  • Designing boards for maximum power reduction and heat dissipation.

Products are more complex than ever before, with unique design requirements ranging from high performance to low power.  Well-defined product development specifications are critical to getting a product that performs right the first time.  Collaboration involving each step of the process-from chip design, package design, material selection to board design-will help us all achieve our shared goal of delivering first-time-right products. 
These issues will be explored during the panel "Boards, Chips & Packaging:  Meeting Market Requirements" at the Semico IMPACT 2015 conference, October 13.  The panel will be comprised of Tarun Amla, Isola; Heidi Barnes, Keysight Technologies; Nathapong Suthiwongsunthorn, UTAC; and Tom Whipple, Cadence.
What:  Semico IMPACT 2015
When:  October 13, 2015
Where:  Computer History Museum, Mountain View, CA
Visit our website for more information and to register.


For more information, contact Rick Vogelei.
Phone: (480) 435 - 8564
About Semico
Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona.  Semico was founded in 1994 by a group of semiconductor industry experts. We have improved the validity of semiconductor product forecasts via technology roadmaps in end-use markets.  Semico offers custom consulting, portfolio packages, individual market research studies and premier industry conferences. 

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