You are here


MEMS Market Update: IoT as a Driving Force

The market for Micro Electrical Mechanical Systems (MEMS) has been growing at a fast rate.  In 2015 sales of MEMS devices exceeded $14.2 billion, an annual growth of 11.6%. Semico Research projects that by 2020 MEMS sales will reach $28.7 billion.  This is a Compound Annual Growth Rate (CAGR) of 15.1% from 2015 to 2020.  Gyroscopes and accelerometers will account for a significant amount of the MEMS revenues. But growth will be driven by a wide variety of emerging MEMS.

Table of Contents: 

Semiconductor Wafers: State of the Market

Silicon wafers are the basic building block for the semiconductors used for the smallest sensor in a light bulb to the most advanced electronic system in the space shuttle.  It all starts from semiconductor grade polysilicon and is processed precisely to fit the needs of each application.

Table of Contents: 

Analog Market Update: Making Digital Systems Come Alive

Analog ICs are critical to nearly all electronic devices.  The global electronics market will consume over 127.5 billion analog ICs in 2016. This translates to several analog ICs per electronic device.  

Table of Contents: 

Semico Fab Database Update Summary First Half 2016

Semico tracks over 900 semiconductor fabs in its Fab Database.  The database includes detailed information about the fabs, including the operating status of the fab, its location, process and products, wafer size and capacity, and more.  The other document included with the database is a Word file containing a summary of updates made to fabs by company type:  Memory, Foundries, and Other.  

Table of Contents: 

The IP Subsystem Market: An Evolving Landscape

The next evolutionary step for the SoC Market is ... IP Subsystems.  This concept involves a "divide and conquer" design strategy that enables designers to increase integration and meet rising customer expectations of performance and functionality.  Semico Research has a new report, "The IP Subsystem Market:  An Evolving Landscape", which examines this market in detail.  Different SoC types are aimed at different applications, and the report details the average number of discrete IP blocks per Basic, Value Multicore, and Advanced Performance Multicore SoC.
Table of Contents: 

ASIC Design Starts: Automotive on a Fast Track

Increasing numbers of IoT solutions, adds to the growth in new design starts.  Certain applications, such as those associated with automotive, are expected to follow a higher growth curve over the next few years.  In addition to all the infotainment accessories and electric vehicle demands that have already been added to vehicles, the vision of autonomous driving brings a need for safety, connectivity and more accurate sensing capabilities.

Table of Contents: 

Semico Wafer Demand: Q1 2016 Highlights

The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2020. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.

Table of Contents: 

Energy Harvesting: The Next Billion Dollar Market for Semiconductors

Whether it’s the Internet of Things (IoT), wearables, or industrial automation, new devices and applications are portable, battery-operated and require continuous power.  Wireless connectivity is required for connecting to the Internet.  Today’s devices collect and transmit data from sensors, are always or almost always on and require power.  The semiconductor industry has met the challenge to design devices for low power operation.  But eventually batteries still run out of energy and have to be replaced or recharged.

Table of Contents: 

3D Printing: The Next Industrial Revolution, 2016 Update

3D printing is an additive manufacturing process.  In recent years, 3D printer prices have dropped substantially, and a wide variety of printable materials is available.  You don’t need to be a CAD expert to create a 3D-printable file.  Media attention has helped further accelerate the industry’s momentum. 

Table of Contents: 

ASIC Design Starts for 2016 by Key End Market Applications

The end-use markets in this study offer high growth opportunities for IC manufacturers.  The market segments include computer, consumer, communication, industrial and transportation.  The end-use applications are a mix of mature and emerging devices.  Some of these products are convergent products that combine features from multiple market segments. 

Table of Contents: