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SiC: Smaller, Faster, More Efficient

Silicon Carbide (SiC) is a wide bandgap material and can be used for discrete components such as Schottky diodes and MOSFETs as well as bare die in power modules. Wide bandgap (WBG) refers to materials that permit devices to operate at much higher voltages, frequencies and temperatures than conventional semiconductor materials like silicon and gallium arsenide. It offers many advantages, including higher thermal conductivity that results in more efficient heat transfer and a lower on-state resistance that decreases conduction losses.

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Silicon and Software Design Cost Analysis: The Impact of AI in EDA Tools

The semiconductor industry today is faced with several substantial issues—not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows.

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Semico Wafer Demand: Q1 2020 Highlights

The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2024. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.

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Semico Wafer Demand: Q4 2019 Highlights

The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.

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RISC-V Market Analysis: The New Kid on the Block

In June 2019, Semico Research initiated a study to quantify the total available market (TAM) for IP cores and estimate the served available market (SAM) for RISC-V IP cores.  We surveyed and interviewed a cross section of the semiconductor industry in order to gather information related to the type of devices that are being designed with RISC-V and their target markets.

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Energy Harvesting: Cultivating Fuel for Electronics

Energy harvesting, also known as power scavenging, is used to describe the collection of energy derived from a variety of external sources such as solar power, thermal energy, wind energy, kinetic energy or electromagnetic sources.  Energy harvesters accumulate the wasted energy in a system, such as heat given off by motors or semiconductors, or the vibrations of motors or other moving objects, for use in another system.  

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Licensing, Royalty and Service Revenues For 3rd Party SIP: A Market Analysis and Forecast for 2019

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years.  If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.

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Semico Wafer Demand: Q3 2019 Highlights

The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2023. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing MOS Logic, Communications MOS Logic, Consumer MOS Logic, Automotive MOS Logic, Other MOS Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Sensors and Digital Bipolar.

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Semico Fab Database: Update Summary 2019

Semico tracks over 1,000 semiconductor fabs in its Fab Database.  The database includes detailed information about the fabs, including the operating status of the fab, its location, process and products, wafer size and capacity, and more.  The other document included with the database is a Word file containing a summary of updates made to fabs by company type:  Memory, Foundries, and Other.  

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ASIC Design Starts 2019: New Applications and AI Become Market Drivers

Many of the traditional end-use applications are experiencing slower design start growth rates due to maturing markets and high design costs.  The unit volumes associated with all applications remain healthy, exhibiting an 8.5% CAGR through 2023. However, removing the unit shipments attached to the new, emerging applications drops the CAGR to only 4.3% through 2023.

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