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Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.

Getting to Know You: The IoT Theme Song

The vision of the Internet of Things places electronics in all aspects of our lives─from knowing what’s in our refrigerator to life-critical functions such as connected, implantable defibrillators. The potential of autonomous driving places our lives in the hands of sensors, processors and wireless communication that we have to assume collect accurate information, processes that information and reacts in real time. Semico has compiled a list of the top ten elements that must align in order for the IoT to come to fruition. Semico’s report on security started a groundswell of discussion and, more importantly, new solutions from chip vendors.

Semiconductor designers have been engrossed in developing solutions that deliver the right performance at the lowest cost while using the least amount of power. But there is another item to add to the list of essentials for IoT adopton. Making sure your customers know you, or more specifically your product specs, is even more important than ever. In the past five years, packaging has become a critical piece of a successful solution. System in Package, 3D chips, and 3D packaging have all been created to serve one or more angles of the power/performance/cost pyramid. What about the results once the chip is mounted onto a board with all its companion chips? How far should the chip manufacturer go in order to control and guarantee performance and reliability in their chips?

System(s)-on-a-Chip: Changes in SoC Design Methodology II

The System-on-a-Chip (SoC) method of creating silicon solutions is delivering on the original high expectations for the future of the semiconductor industry and ASIC markets.  Designs of very high complexity are regularly accomplished using this approach today, far beyond what was possible only five or six years ago using more traditional ASIC methodologies. A new published report from Semico Research, System(s)-on-a-Chip: Changes in SoC Design Methodology forecasts that the SoC Market Forecast will approach $200 Billion by 2019.
 

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Semico Research Announces Impact 2015 Speaker Lineup - Reserve Your Seat Now!

Semico Research is proud to announce the speaker lineup for the 2015 Impact Conference, to be held October 13 at the Computer History Museum (1401 N Shoreline Blvd., Mountain View, California 94043).  Confirmed speakers include the following:
 
Jim Feldhan, Semico Research Corp.
Tarun Amla, Isola
Daniel DeAraujo, Mentor Graphics
Brian Fuller, ARM
Lee Ritchey, Speeding Edge
Scott McMorrow, Samtec
Geoffrey Hazelett, Polar Instruments
Daniel DeAraujo, Mentor Graphics
Nathaniel Unger, Altera
Robert L. Sankman, Intel

Android Marshmallow to Boost NFC Payments

The Internet is buzzing with Google's official announcement of Android Marshmallow.  When it rolls out this fall, it will include Android Pay.  Android Pay is essentially a streamlined version 2.0 of Google Wallet, originally introduced in 2010.  All the new system requires is that you unlock your phone and place it near the contactless terminal at the point of sale.  Google Wallet involved launching an app and typing in a pin number. 
 

Licensing, Royalty and Service Revenues for 3rd Party SIP: A Market Analysis and Forecast for 2015

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market. A new report from Semico Research, "Licensing, Royalty and Service Revenues for 3rd Party SIP: Market Analysis and Forecast for 2015," forecasts the worldwide IP Market to approach 8 billion by 2019.

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Semiconductor IP Market to Approach $8 Billion by 2019, says Semico Research

The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market.

Semico Research Announces Impact 2015 Panel: How Do We Get to Next-Generation High Speed Data Transfer Rates?

The need for more bandwidth is continuing to drive the Internet infrastructure. Rapid growth of server, network and internet traffic is fueling the need for higher data rates. Key contributors to data demand include Internet consumer applications, cloud-based computing and storage, virtual servers, advances in scientific and financial computing and the Internet of Things. While fiber optic cables are capable of delivering data rates into terabits/sec, the main bottleneck continues to be the last critical mile solution.

Semico Research Releases Latest Fab Database Report: Highlights Where Billions of Dollars in Capex are Being Spent

One of the largest events in the semiconductor industry, SEMICON West just wrapped up another successful show.  Semico Research was there and observed that the used equipment portion was particularly well-attended.  With the emergence of the IoT, MEMS and sensor production are in higher demand than ever before.  These devices are produced in 200mm fabs that are fully depreciated and very efficient.  Many analog products are also made on 200mm equipment, although some production is turning to 300mm.  The increase in demand for 200mm production has increased the need for used equipment.

Unexpected Surprises at SEMICON West 2015

As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about.

Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that I think are driving growth and excitement at semiconductor equipment and material companies.

First, the major driver of equipment spending is changing from a focus on new greenfield fabs to the technology transitions that are and are not happening. Gary Dickerson, CEO of Applied Materials, clearly laid out the ‘inflections’. 3D NAND devices are a material enabling inflection and 10nm/7nm logic devices are driving a litho or patterning inflection. What does all this mean? The bottom line is more steps and more tools.

Semico Fab Database and Update Summary First Half 2015

Semico tracks over 890 semiconductor fabs in its Fab Database.  The database includes detailed information about the fabs, including the operating status of the fab, its location, process and products, wafer size and capacity, and more.  The other document included with the database is a Word file containing a summary of updates made to fabs by company type:  Memory, Foundries, and Other.  

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