Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
One of the most overlooked aspects of hardware design is the key role that materials selection plays in the overall product development process. For example, laminates are the foundation upon which all other components, both hardware and software, depend in order to ensure that the products into which they are incorporated are functionally operational.
The System-on-a-Chip (SoC) method of creating silicon solutions is delivering on the original high expectations for the future of the semiconductor industry and ASIC markets. Designs of very high complexity are regularly accomplished using this approach today, far beyond what was possible only five or six years ago using more traditional ASIC methodologies.
The thirst for higher bandwidth--driven by mobile, Big Data, and higher performance computing applications--presents new challenges for the designers of very high speed PCBs and IC packages. Faster PCIe, SATA, and SAT interfaces and new 100G/400G systems featuring multi-lane 25-32Gbps SerDes (moving to 56Gbps), and higher density, lower power, smaller footprint HPC/HBM/3D NAND memory interfaces are sparking a move to signaling technologies (PAM4/8), improved board/package materials, and a better signal/power integrity design discipline.
The vision of the Internet of Things places electronics in all aspects of our lives─from knowing what’s in our refrigerator to life-critical functions such as connected, implantable defibrillators. The potential of autonomous driving places our lives in the hands of sensors, processors and wireless communication that we have to assume collect accurate information, processes that information and reacts in real time. Semico has compiled a list of the top ten elements that must align in order for the IoT to come to fruition. Semico’s report on security started a groundswell of discussion and, more importantly, new solutions from chip vendors.
Semiconductor designers have been engrossed in developing solutions that deliver the right performance at the lowest cost while using the least amount of power. But there is another item to add to the list of essentials for IoT adopton. Making sure your customers know you, or more specifically your product specs, is even more important than ever. In the past five years, packaging has become a critical piece of a successful solution. System in Package, 3D chips, and 3D packaging have all been created to serve one or more angles of the power/performance/cost pyramid. What about the results once the chip is mounted onto a board with all its companion chips? How far should the chip manufacturer go in order to control and guarantee performance and reliability in their chips?
The System-on-a-Chip (SoC) method of creating silicon solutions is delivering on the original high expectations for the future of the semiconductor industry and ASIC markets. Designs of very high complexity are regularly accomplished using this approach today, far beyond what was possible only five or six years ago using more traditional ASIC methodologies. A new published report from Semico Research, System(s)-on-a-Chip: Changes in SoC Design Methodology forecasts that the SoC Market Forecast will approach $200 Billion by 2019.
Semico Research is proud to announce the speaker lineup for the 2015 Impact Conference, to be held October 13 at the Computer History Museum (1401 N Shoreline Blvd., Mountain View, California 94043). Confirmed speakers include the following:
Jim Feldhan, Semico Research Corp.
Tarun Amla, Isola
Daniel DeAraujo, Mentor Graphics
Brian Fuller, ARM
Lee Ritchey, Speeding Edge
Scott McMorrow, Samtec
Geoffrey Hazelett, Polar Instruments
Daniel DeAraujo, Mentor Graphics
Nathaniel Unger, Altera
Robert L. Sankman, Intel
The Internet is buzzing with Google's official announcement of Android Marshmallow. When it rolls out this fall, it will include Android Pay. Android Pay is essentially a streamlined version 2.0 of Google Wallet, originally introduced in 2010. All the new system requires is that you unlock your phone and place it near the contactless terminal at the point of sale. Google Wallet involved launching an app and typing in a pin number.
The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market. A new report from Semico Research, "Licensing, Royalty and Service Revenues for 3rd Party SIP: Market Analysis and Forecast for 2015," forecasts the worldwide IP Market to approach 8 billion by 2019.
