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Press Releases

We Break Down Wafer Demand So You Don't Have To

Phoenix, Arizona April 25, 2012 - Wafer demand grows at a compound annual growth rate of about 8-9%, but you could be making a big mistake if you think capital investment in fab capacity will be successful by sticking with an 8-10% investment rate every year.

MEMS Displays to grow 62% by 2016

Phoenix, Arizona April 19, 2012 - The market for optical based MEMS is poised for exponential growth. In addition to MEMS devices for projection, MEMS for direct view displays have emerged. The total market was under $1 billion in 2011, but by 2016 it will reach $10.4 billion.

Mike Noonen and Steve Roddy to Speak at Semico IP Conference

Phoenix, Arizona April 11, 2012 - Semico is proud to announce the addition of Mike Noonen and Steve Roddy to its speaker lineup for the IP Ecosystem conference to be held May 16, 2012. They will participate on the panel titled, Will IP Subsystems Help Reduce Complexity...At What Cost? Other companies represented include ARM, Cadence Sonics, Synopsys, Mentor Graphics, Atrenta, Memoir Systems, Analog Bits, Tabula, and TSMC.

Let's Talk About 450mm at the Semi Breakfast Forum

Jim Feldhan
Semico Research

Phoenix, Arizona April 5, 2012 - What might be coming to Arizona? That's the question Jim Feldhan will be answering at the upcoming Semi Breakfast Forum. Join us on April 24th at Intel to hear Ron Rinfret with Intel, Kirk Hasserjian at Applied Materials, Jim Feldhan with Semico, and Abbie Gregg discuss the highlights, challenges and outlook for 450mm.

Semico IMPACT Conference: Will IP Subsystems Help Reduce Complexity? At What Cost?

Phoenix, Arizona March 27, 2012 - With rising SoC complexity, silicon and software design costs are rising. Further, the cost to integrate 100 or more discrete IP blocks into a complex SoC silicon is also rising. With the evolution of complex SoC architectures, the need for better, more comprehensive, higher performing IP has never been greater. In the search for better solutions, does the IP Subsystem have a role to play, or is there a better, more efficient path the industry can take?

ASIC Design Starts: New Growth Ahead

Phoenix, Arizona March 20, 2012 - The ASIC Design Start landscape has changed since 2006 to accommodate increasing design costs, rising design complexity and lengthening design cycle times, especially in the System-on-a-Chip (SoC) market. These changes are having an impact on the ASIC Design Start market as the broader semiconductor market has mostly recovered from the financial meltdown that occurred in the 3rd quarter of 2008 and into the first part of 2009.

Join IP Industry Leaders at the May 16 Semico IMPACT Conference

Phoenix, Arizona March 14, 2012 - From IP providers to foundries to end customers, the entire IP ecosystem will be represented at the May 16, 2012 Semico IMPACT Conference. We are proud to announce participation from ARM, Sonics, Synopsys, Cadence, Analog Bits, Mentor Graphics, TSMC, Tabula, Atrenta, and Memoir Systems. Register today to ensure you don't miss this event!

ASIC Design Starts: Communications Dominate but Smart Grid and Transportation Growing Faster

Phoenix, Arizona March 6, 2012 - The ASIC design start landscape has seen dramatic changes as end market demand rose and fell due to the financial meltdown in 2008, recovery in 2009 and 2010 and more uncertainty due to natural disasters and financial market fluctuations in 2011. Rising consumer spending for mobile and portable electronic devices helped mitigate some of the impact of these fluctuations on the ASIC design start landscape. Another result of this tumult is the repartitioning of the System-on-a-Chip (SoC) market into three categories instead of the traditional two categories.

May 16th: Focus on the IP Ecosystem

Phoenix, Arizona March 1, 2012 - In the past, much of the limelight has been given to semiconductor process technology and development. While process technology advancements continue at a blistering pace, other challenges have bubbled to the surface. The ability for chip and system designers to fully utilize the ever increasing number of available transistors has become an arduous task. Pressures to have the product designed on schedule and within budget have created enormous challenges.

3D Packaging is Coming; Are You Ready?

Jim Feldhan to Deliver BiTS 2012 Keynote Address Phoenix, Arizona Februay 29, 2012 - As ICs become more complicated and push the technology roadmap, system performance and chip-to-chip interaction is becoming a limiting factor. The result is that test and packaging issues are coming to the forefront at semiconductor manufacturers around the world. 2.5D and 3D packages offer great advantages, yet there are still technical issues to overcome.