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3D Packaging is Coming; Are You Ready?

Jim Feldhan to Deliver BiTS 2012 Keynote Address Phoenix, Arizona Februay 29, 2012 - As ICs become more complicated and push the technology roadmap, system performance and chip-to-chip interaction is becoming a limiting factor. The result is that test and packaging issues are coming to the forefront at semiconductor manufacturers around the world. 2.5D and 3D packages offer great advantages, yet there are still technical issues to overcome. 3-D technology is in the early adopter phase, and server memory, routers, base stations, and switching equipment will be the first markets to use 3-D packaging for increased performance and functionality. Growth will explode from 2015 - 2016, when 3D is expected to move to smartphones. Jim Feldhan, President of Semico Research, will deliver the keynote address at the BiTS 2012 conference on March 5, 2012. Mr. Feldhan will present the Semico roadmap to 3D packaging, the end products that will adopt 3D first and how that adoption will evolve over time. Mr. Feldhan will also provide a brief economic overview along with Semico's Semiconductor Forecast. The 13th annual BiTS (Burn-in & Test Strategies Workshop) 2012 will take place March 4-7 in Mesa, Arizona. Event link: Feldhan's speech link: 3D Packaging is one of those exciting technologies still in infancy with high growth ahead of it. Semico will soon release a study on 3D technologies. If you'd like to learn more about Semico's 3D research, contact Jim Feldhan at 602-997-0337 or About Semico We are a semiconductor marketing & consulting research company located in Phoenix, Arizona. Semico was founded in 1994 by a group of semiconductor industry experts. We have improved the validity of semiconductor product forecasts via technology roadmaps in end-use markets. Semico offers custom consulting, portfolio packages, individual market research studies and premier industry conferences.

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