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Press Releases and News

3D Packaging is Coming; Are You Ready?

Jim Feldhan to Deliver BiTS 2012 Keynote Address Phoenix, Arizona Februay 29, 2012 - As ICs become more complicated and push the technology roadmap, system performance and chip-to-chip interaction is becoming a limiting factor. The result is that test and packaging issues are coming to the forefront at semiconductor manufacturers around the world. 2.5D and 3D packages offer great advantages, yet there are still technical issues to overcome.

The Time Has Come For MEMS Oscillators

Phoenix, Arizona February 21, 2012 - The MEMS oscillator market is still at a nascent stage. It represents less than one percent of the total timing market of $6.3 billion. Nevertheless, the potential growth of MEMS oscillators continues to attract more vendors. There are currently nine vendors shipping MEMS oscillators. Two more have announced they will start shipping later in 2012. More are expected to jump into this market.

Warren East, CEO of ARM, to Keynote at Semico IP Conference

Phoenix, Arizona February 15, 2012 - Semico is proud to announce Warren East, CEO of ARM Holdings, will deliver the keynote address on May 16th, 2012 at the Semico IMPACT Conference: Focus on the IP Ecosystem. ARM is the world's leading supplier of semiconductor intellectual property with over 20 billion ARM-based chips shipped to date. In a year when semiconductor revenues were flat, ARM's revenues increased 24% in FY2011 to $785 million. Warren East will open Semico's IP conference providing his vision of what this industry needs to continue on a path of innovation and success.

New Tech Charging Up the Mobile Battery Market

Phoenix, Arizona January 24, 2012 - Battery life has always been a limiting issue when it comes to mobile electronics. Over the past two decades consumers have consistently complained about usable time with their smart phones, notebooks, etc. Ten years ago the introduction of Li-ion (lithium ion) batteries made a marked improvement in battery life; however, the same complaint continues to plague the mobile electronics industry.

Semico IMPACT Conference: Who Wins in the IP Ecosystem?

Phoenix, Arizona January 31, 2012 - SoC designers today are faced with a whole range of issues and questions that must be dealt with before they reach a final silicon solution. The pursuit of a successful resolution to these questions and issues is becoming ever more difficult. In classic fashion, a vibrant ecosystem has grown up around the SoC design community in an effort to provide solutions and answers to SoC designers. The importance of the ecosystem grows with every passing year and process node.

36% of Fabs in High-Risk Zones: Semico Releases Semiconductor Updated Fab Database

Phoenix, Arizona January 17, 2012 - Semiconductor revenues were flat in 2011 as the industry dealt with numerous challenges. These changes have impacted the status of semiconductor fabs worldwide: capacity, capex, wafer size, closures, launches, production ramps, technology node migration, and employee count.

SAVE THE DATE: May 16, 2012 -- Semico IMPACT Conference Series: The IP Ecosystem

Phoenix, Arizona January 5, 2012 - Semico is accepting speaking applications for our upcoming conference focusing on the IP industry. Semiconductor IP is a crucial component in the design and development of complex integrated circuits, especially SoCs. This one-day event will focus on the benefits of third-party IP and issues that are enabling or hindering the growth of semiconductor IP.

Happy Holidays from Semico! All indicators do show a better 2012!

Phoenix, Arizona December 21, 2011 - Semico wishes you a wonderful Holiday Season and a healthy and prosperous 2012.

Semico accurately predicted the slowdown that started this summer, and now the IPI is indicating a positive turn in the second quarter of 2012. Our 2012 forecast is up almost 10% over 2011.

Contact Jim Feldhan at 602-997-0337 or jfeldhan@semico.com to order the IPI.

All the best,
Semico

Jim Feldhan Identifies Key Markets for TSV Applications

Phoenix, Arizona December 13, 2011 - Today at the 3-D Architectures for Semiconductor Integration and Packaging event in Burlingame, CA, Jim Feldhan, President, Semico Research Corp. addressed the end market applications that are driving 3-D semiconductor packaging. Even as the semiconductor industry suffers from a slowdown, innovators continue to develop 3-D packaging options.

The Great Semiconductor Migration

Phoenix, Arizona December 6, 2011 - In previous forecast periods, there have been dozens of products that have lead innovation within semiconductors. Affectionately called "Splitters" by our Senior VP Morry Marshall, consumers have historically demanded a variety of mobile devices to fit their needs.

No more. We're in a revolutionary period of content distribution and as the old saying goes, content is king. To adapt, OEMs are going to need new strategies that understand not only how to market to consumers, but how their needs are evolving, and how they can foresee solutions.

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