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August 2015

Semico Research Announces Impact 2015 Keynote: Pushing the Envelope on Bandwidth

The thirst for higher bandwidth--driven by mobile, Big Data, and higher performance computing applications--presents new challenges for the designers of very high speed PCBs and IC packages.  Faster PCIe, SATA, and SAT interfaces and new 100G/400G systems featuring multi-lane 25-32Gbps SerDes (moving to 56Gbps), and  higher density, lower power, smaller footprint HPC/HBM/3D NAND memory interfaces are sparking a move to signaling technologies (PAM4/8), improved board/package materials, and a better signal/power integrity design discipline.

Getting to Know You: The IoT Theme Song

The vision of the Internet of Things places electronics in all aspects of our lives─from knowing what’s in our refrigerator to life-critical functions such as connected, implantable defibrillators. The potential of autonomous driving places our lives in the hands of sensors, processors and wireless communication that we have to assume collect accurate information, processes that information and reacts in real time. Semico has compiled a list of the top ten elements that must align in order for the IoT to come to fruition. Semico’s report on security started a groundswell of discussion and, more importantly, new solutions from chip vendors.

Semiconductor designers have been engrossed in developing solutions that deliver the right performance at the lowest cost while using the least amount of power. But there is another item to add to the list of essentials for IoT adopton. Making sure your customers know you, or more specifically your product specs, is even more important than ever. In the past five years, packaging has become a critical piece of a successful solution. System in Package, 3D chips, and 3D packaging have all been created to serve one or more angles of the power/performance/cost pyramid. What about the results once the chip is mounted onto a board with all its companion chips? How far should the chip manufacturer go in order to control and guarantee performance and reliability in their chips?

System(s)-on-a-Chip: Changes in SoC Design Methodology II

The System-on-a-Chip (SoC) method of creating silicon solutions is delivering on the original high expectations for the future of the semiconductor industry and ASIC markets.  Designs of very high complexity are regularly accomplished using this approach today, far beyond what was possible only five or six years ago using more traditional ASIC methodologies. A new published report from Semico Research, System(s)-on-a-Chip: Changes in SoC Design Methodology forecasts that the SoC Market Forecast will approach $200 Billion by 2019.
 

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Semico Research Announces Impact 2015 Speaker Lineup - Reserve Your Seat Now!

Semico Research is proud to announce the speaker lineup for the 2015 Impact Conference, to be held October 13 at the Computer History Museum (1401 N Shoreline Blvd., Mountain View, California 94043).  Confirmed speakers include the following:
 
Jim Feldhan, Semico Research Corp.
Tarun Amla, Isola
Daniel DeAraujo, Mentor Graphics
Brian Fuller, ARM
Lee Ritchey, Speeding Edge
Scott McMorrow, Samtec
Geoffrey Hazelett, Polar Instruments
Daniel DeAraujo, Mentor Graphics
Nathaniel Unger, Altera
Robert L. Sankman, Intel

Android Marshmallow to Boost NFC Payments

The Internet is buzzing with Google's official announcement of Android Marshmallow.  When it rolls out this fall, it will include Android Pay.  Android Pay is essentially a streamlined version 2.0 of Google Wallet, originally introduced in 2010.  All the new system requires is that you unlock your phone and place it near the contactless terminal at the point of sale.  Google Wallet involved launching an app and typing in a pin number. 
 

Semico Research Announces Impact 2015 Panel - Boards, Chips & Packaging: Meeting Market Requirements

The Internet of Things promises an unprecedented opportunity for the electronics industry.  From front-end devices like roadway sensors to back-end network equipment supporting the rush of new data inputs, electronics are the integral foundation of this new era.  More than ever, pressure is on the electronics industry to deliver the right solution at the right time and at the right price. 

Boards, Chips and Packaging: Hardware Takes Center Stage

Today’s electronic products have become so sophisticated and ubiquitous that we have come to expect that each new generation will address both our current and future needs. Years ago, the industry was hardware-centric and driven by “big iron” products. Capacity and functionality were thoroughly dependent upon increasingly complex hardware. Think of the movies of the 50s where “high tech” data was encoded on paper cards that were then fed into a massive bank of computers. Then move to the current, often-cited technology fact that an iPhone has more computing power in it than the technology that took the Apollo astronauts to the moon.

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