As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about.
Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that I think are driving growth and excitement at semiconductor equipment and material companies.
First, the major driver of equipment spending is changing from a focus on new greenfield fabs to the technology transitions that are and are not happening. Gary Dickerson, CEO of Applied Materials, clearly laid out the ‘inflections’. 3D NAND devices are a material enabling inflection and 10nm/7nm logic devices are driving a litho or patterning inflection. What does all this mean? The bottom line is more steps and more tools.