Boards, Chips and Packaging:
Designing to Maximize Results
Computer History Museum
1401 N Shoreline Blvd., Mountain View, CA 94043
October 13, 2015
Today, chip designers craft their semiconductor products to meet ever-increasing market demands for lower power, higher performance and lower costs. While chips may meet system specifications, these complex designs require even more attention at the packaging and board level to obtain the full benefit of the chip design. Performance, power dissipation and formfactor challenges require a rechanneling of system design effort away from merely implementing ever more-complex silicon solutions towards dealing with complex applications from a system integration point of view. The rollout of 3D, 2.5D and silicon interposers adds yet another dimension. The new model must incorporate tasks that had previously been accomplished in silos and once held as separate functions. The creation of the system solution now requires planning chip design with packaging and PCB layout to create the optimal end application.
On October 13th, 2015, industry experts met at the Semico Impact conference for discussion, insight, and collaboration to enhance system-level design, performance and cost savings with first time right solutions. Boards, Chips and Packaging: Designing to Maximize Results was well-attended by board designers, system architects, chip designers, package designers, program managers, and marketing executives involved in the system-level ecosystem decisions. A highlight of the day was a keynote by Captain Chesley B. "Sully" Sullenberger, best known for serving as Captain during what has been called the "Miracle on the Hudson". He is known for his expertise in safety and knowledge of improvements of high-performance systems to save lives, save money and bring value to communities.
Captain Chesley B. "Sully" Sullenberger, and Jim Feldhan, Semico Research
The morning and afternoon panel sessions provided some great discussion among the participants as well as thoughtful question and answer sessions with the audience.
Morning Panel: From left to right, Brian Fuller, ARM; Lee Ritchey, Speeding Edge; Scott McMorrow, Samtec; Geoffrey Hazelett, Polar Instruments; Daniel DeAraujo, Mentor Graphics; and Nathaniel Unger, Altera.
For more information contact:
Jim Feldhan
602-997-0337 Opt#1
jimf@semico.com
Joanne Itow
602 997-0337 Opt #2
joannei@semico.com
