The ConFab 2012 highlighted sessions on the semiconductor industry’s blockbuster topics impacting advance technology manufacturing such as the transition to 450mm wafers and the increasing importance of 3D integration and advanced packaging. But this year the conference also allocated time to a discussion revolving around legacy manufacturing. Unlike finFETs and 450mm wafers, the challenges faced by mature production facilities are seldom in the headlines. However, as Sanjay Rajguru, Director at SEMATECH/ISMI, pointed out, over half of the current fab capacity comes from facilities that are more than 10 years old.
The challenges faced by older production facilities include equipment obsolescence, skills obsolescence, availability of parts, software and support and equipment capability extension and tool re-use. Maintaining “More than Moore” fabs is a major concern to semiconductor manufacturers as these operations reach 20 or even 30 years old.
At the ConFab 2012 Executive Roundtable representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks and possible solutions.