Next week Intel will be presenting several papers at the IEDM in San Francisco. Mark Bohr, Intel Senior Fellow and some of the research team previewed three of the topics being presented. The common theme through all three papers reflects Intel’s drive to push conventional technology as far as it will possibly go. The company feels that’s easier to do rather than introduce a whole new set of materials at this time. That being said, Intel also pursues new material research. The plan is to have options and solutions available and ready to implement when traditional silicon processing runs out of steam.
Following is a quick review of three papers that Intel will be presenting.
32nm Logic Technology
In September 2007, Intel announced their fully functional 32nm SRAM with a 0.18um2 cell size. Today they are touting a 291Mbit SRAM, the same density as before, but with a 0.171um2 cell size. This SRAM chip features greater than 1.9 billion transistors operating at 3.8GHz. Intel is on track for production readiness in Q4 2009.