Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
published by Rich Wawrzyniak on Wed, 2015-10-07 15:38
If there is one constant in our mobile, connected society today, it is the continual demand for moving more data, more efficiently and at less cost. This dynamic underscores virtually every technology and end market. It is a trend that is proving to be critical to the semiconductor industry as well as companies like Facebook and Google that participate in the efforts to create the standards necessary to deploy 400G data channels for data centers.
The high speed channel initiative is aimed at the data center. It is a certainty the high targeted speeds will allow more data to be moved more quickly into edge devices and eventually smart phones, tablets and other mobile devices. While the transition to these speeds by devices is still in the future, there is market pressure to increase the data communication capabilities of the SoCs in mobile systems.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2020. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.
Engineers and product designers face more challenges than ever before in bringing successful products to market. The advent of the IoT requires more features and mobility in new products. At the IMPACT Conference Boards, Chips and Packaging: Designing to Maximize Results, industry executives will highlight ways to solve these challenges.
In the past, integrated circuits, packages and boards were all designed independently and yet in most cases still managed to fit together with very few functional or technical problems. However recent advances in chip performance have changed this process dramatically. New designs, processes and materials have already been seen in packaging as high performance semiconductor chips need to carefully match the size, power and performance requirements of more demanding end applications. For optimal system performance, specific information related to material, speed and stability has created the need to improve information exchange and collaboration for successful board design. While collaboration is not new to the industry, we are now at a point where collaboration needs to be extended to all parts of the electronic ecosystem in order to maximize system performance while minimizing costs.