3D Architectures for Semiconductor Integration and Packaging.

3-D integration and packaging is now well known to all in the semiconductor industry.  Today the focus has shifted away from trying to understand the technology opportunity to one of understanding the practical challenges of technology adoption and commercialization, including who is getting there first, how, and at what cost.  Many see 3-D integration and packaging as an industry inflexion point, not just an evolutionary change—thus there is a natural degree of uncertainty as companies scramble to secure market share, obtain new process and design tools, and of course, new customers and new applications.

The 7^th International Conference— 3-D ARCHITECTURES FOR SEMICONDUCTOR INTEGRATION AND PACKAGING—continues to give a broad, yet thorough perspective on the techno-market opportunity and challenge offered by building devices and systems in the vertical dimension.  Industry leaders from around the world are invited to speak at this conference, on a range of topics important to the emerging and on-going 3-D integration and packaging efforts.  The format of the conference and its presentations enables speakers to present the most up-to-date and forthright perspectives as possible, and targets senior-level technologists, managers, and CEOs as speakers and attendees from leading companies and organizations around the world.  The result is a unique forum where one can gain the latest insights to bring clarity in the direction of their own efforts.

3-D ARCHITECTURES FOR SEMICONDUCTOR INTEGRATION AND PACKAGING

December 8-10, 2010
Hyatt Regency San Francisco Airport Hotel, Burlingame, California, USA

http://techventure.rti.org/Winter2010