In an ongoing effort to address major concerns and trends in the IP and design market spaces, there have been many alternative technologies offered as possible solutions. Dielets or Chiplets is one such technology and it has recently gained momentum in that dialogue, highlighted by multiple discussions and conferences toward their use in multi-die subsystems and systems.
System Design: More Options, More Design Starts?, a new Technology Brief from Semico, provides key insight into the dielet/chiplet technology and its possible adoption.
