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Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.

Semico Impact 2015

Boards, Chips and Packaging:

Designing to Maximize Results

Please register on-site for $150 beginning at 7:30am, Oct. 13
Questions?  Contact Rick Vogelei at 480-435-8564

Computer History Museum
1401 N Shoreline Blvd., Mountain View, CA 94043
October 13, 2015

The Increasing Demand for High Speed Communications Channels

If there is one constant in our mobile, connected society today, it is the continual demand for moving more data, more efficiently and at less cost.  This dynamic underscores virtually every technology and end market. It is a trend that is proving to be critical to the semiconductor industry as well as companies like Facebook and Google that participate in the efforts to create the standards necessary to deploy 400G data channels for data centers.
The high speed channel initiative is aimed at the data center. It is a certainty the high targeted speeds will allow more data to be moved more quickly into edge devices and eventually smart phones, tablets and other mobile devices. While the transition to these speeds by devices is still in the future, there is market pressure to increase the data communication capabilities of the SoCs in mobile systems.

Inaugural Boards, Chips and Packaging IMPACT Conference Adds 15 Industry Experts to Presentation List

Panel sessions and presentations focus on latest innovations in technology including how  board, chip and packaging companies can better function in an integrated, system-level ecosystem

Tony Massimini to Speak at SEMI AZ Breakfast October 16

SEMI AZ Breakfast
Monetizing the IoT: Opportunities and Challenges for the Semiconductor Industry

Come hear Tony Massimini and other Industry Experts

Friday, October 16, 2015 7:30 AM-11:00 AM 
Freescale Semiconductor, Inc., 2100 East Elliot Road, Tempe, Arizona

Semico Wafer Demand: Q3 2015 Highlights

The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2020. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.

Table of Contents: 

IMPACT Conference Keynotes: Advanced Chip Packaging, Simulation-Driven Product Design

Engineers and product designers face more challenges than ever before in bringing successful products to market.  The advent of the IoT requires more features and mobility in new products.  At the IMPACT Conference Boards, Chips and Packaging: Designing to Maximize Results, industry executives will highlight ways to solve these challenges.

System Design Requirements Demand a Creatively Choreographed Ecosystem

In the past, integrated circuits, packages and boards were all designed independently and yet in most cases still managed to fit together with very few functional or technical problems. However recent advances in chip performance have changed this process dramatically. New designs, processes and materials have already been seen in packaging as high performance semiconductor chips need to carefully match the size, power and performance requirements of more demanding end applications. For optimal system performance, specific information related to material, speed and stability has created the need to improve information exchange and collaboration for successful board design. While collaboration is not new to the industry, we are now at a point where collaboration needs to be extended to all parts of the electronic ecosystem in order to maximize system performance while minimizing costs.

IMPACT Conference Panel to Address Meeting Market Requirements for the IoT

Semico IMPACT Conference Afternoon Panel -- Boards, Chips & Packaging:  Meeting Market Requirements 

IMPACT Conference Panel to Address Meeting Market Requirements for the IoT

The Internet of Things promises an unprecedented opportunity for the electronics industry.  From front-end devices like roadway sensors to back-end network equipment supporting the rush of new data inputs, electronics are the integral foundation of this new era.  More than ever, pressure is on the electronics industry to deliver the right solution at the right time and at the right price. A panel will discuss this important issue during the Semico IMPACT Conference: Designing to Maximize Results, October 13, Computer History Museum, 1401 N Shoreline Blvd., Mountain View, California 94043.

Semico Lowers Forecast as NAND Prices Weaken

Semico expects to see a stronger market in the second half of 2015, based on strong increases in our IPI index in the second half of 2014.  The IPI accurately predicts semiconductor revenue inflection points four quarters in advance.  Recent economic events and fears of weakness in some end markets have resulted in substantial downgrades in forecasts from other prognosticators. In the past we too have fallen into this trap only to look back to say that the IPI was more correct. Forecasting the semiconductor market is not for the "faint of heart".


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