Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
The next evolutionary step for the SoC Market is ... IP Subsystems. This concept involves a "divide and conquer" design strategy that enables designers to increase integration and meet rising customer expectations of performance and functionality. Semico Research has a new report, "The IP Subsystem Market: An Evolving Landscape", which examines this market in detail. Different SoC types are aimed at different applications, and the report details the average number of discrete IP blocks per Basic, Value Multicore, and Advanced Performance Multicore SoC.
The cell phone market made up over half the MEMS unit volume in 2015. The low-end smartphones have fewer MEMS, but this segment is growing faster and cannibalizing feature phones. The low-end smartphones also have a growing number of MEMS in their Bill of Materials (BOMs). Unfortunately, growth in the cell phone market has slowed as the market has matured. What will be the next driver of substantial growth for MEMS?
Analog ICs are critical to nearly all electronic devices. The global electronics market will consume over 127.5 billion analog ICs in 2016, which translates to several analog ICs per electronic device. Analog ICs experienced stronger than average growth over the last several years as the mobility products grew at double digit rates. These products have a higher than average analog content thus growth has exceeded the overall market.
published by Adrienne Downey on Thu, 2016-07-21 00:58
Semico Research was pleased to host the 3D printing TechXPOT at SEMICON West 2016, in conjunction with SEMI. We also hosted the inaugural 3D printing session at SEMICON West 2014. What is striking is how much the 3D printing industry has changed in those two years. In 2014, 3D printing was at the height of media attention; the major questions were when each home would have its own 3D printer. In 2016, the conversation is much more focused on certain industries where 3D printing shines—namely, healthcare, automotive, and aerospace. In 2014, we were just beginning to put plastics and metals in the same 3D printed object. In 2016, the focus is now on refining those materials for conductivity and reducing design time and costs for PCBs.
As the semiconductor industry approaches the end of the second decade of the 21st century, substantial changes to the System-on-a-Chip (SoC) design methodology are taking shape. Instead of dealing with SoC design at the lowest common denominator – the discrete SIP block, SoC designers now look to move up a layer of abstraction to design with system level functionality to reduce the effort and cost associated with complex SoC designs today.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2020. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.
Interest in China is at a fever pitch, with the country's National IC Industry Investment Fund leading the way. The latest to announce a project in China is GLOBALFOUNDRIES, with plans for a 300mm fab in a joint venture with the government of Chongqing. As the project involves upgrading an existing fab, production is planned for 2017. Lots of projects are going on in China right now -- are you keeping up?