Semico Technology Brief -- System Design: More Options, More Design Starts?

In an ongoing effort to address major concerns and trends in the IP and design market spaces, there have been many alternative technologies offered as possible solutions.  Dielets or Chiplets is one such technology and it has recently gained momentum in that dialogue, highlighted by multiple discussions and conferences toward their use in multi-die subsystems and systems.
 
System Design: More Options, More Design Starts?,  a new Technology Brief from Semico, provides key insight into the dielet/chiplet technology and its possible adoption.
 
Key takeaways from this Technology Brief include:

• Design issues spurring the need for chiplets
• Top-line results from the recent Semico/ESD survey of IP executives on chiplets, including the major challenge of adopting chiplets
• Pros and cons of designing a system using an advanced monolithic SoC, discrete ICs on a PCB or chiplets on a substrate
• Silicon and software design cost trends
• Forecast for number of advanced design starts by process geometry

For additional information, contact Rick Vogelei at rickv@semico.com or 480-435-8564.